Fluorine is the simplest molecule containing fluorine atoms, and it is these atoms you want to be delivering to the process chamber for cleaning or etching. The bond strength of F-F is much lower than any other F-bond and thus much less energy is required to create F atoms or radicals than if F is bonded to any other element. This means that for a given process chamber configuration, to deliver the same number of fluorine atoms / radicals as any other gas, lower power or temperature is required.
Obviously this opens up a greater process window and tests have shown that the same RPS generator can deliver up to 5x more fluorine than NF3 which enables up to 3x faster cleaning. More.
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