A. TI has been using proven silicon on a chip technology (SOC) to build multi-core DSPs on a single die for sometime. Our C5420, C5421 and recently announced C5441 demonstrate our long-term commitment to that strategy.
Multi-core C55x and C64x devices are possible in the future. More.
I cant really gove you an answer,but what I can give you is a way to a solution, that is you have to find the anglde that you relate to or peaks your interest. A good paper is one that people get drawn into because it reaches them ln some way.As for me WW11 to me, I think of the holocaust and the effect it had on the survivors, their families and those who stood by and did nothing until it was too late.